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Sample report for adhesive category. Other reports may vary in format.
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| 15.18USA - Phenolics - U.S. Adhesives
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Phenolic / Phenolics include all unmodified, alkylated, or otherwise modified phenolformaldehyde condensation products, both heat reactive (resole) and non-heat reactive (novolac) types. Phenolics find wide use as tackifiers, and crosslinking agents, for various elastomeric polymers used in adhesive compositions. Phenolics are commonly used as tackifiers with neoprene, nitrile, butyl, styrene butadiene (SBR), and ethylene propylene terpolymer rubbers in both solvent borne and water latices. They are also used for tackifying pressure sensitive adhesives based on vinyl ethyl ether. Plastisols and rubbers also utilize phenolic resins for adhesion promotion. Structural adhesives based on polyvinyl butyl, nitrile rubber, and epoxies are formulated with phenolics used as a crosslinking agent. In essence, phenolic resins upgrade the specific adhesion and tack of a high molecular weight elastomer. Resoles are also used as modifiers for various thermoplastic polymers to provide efficient and economical methods of building thermosetting capabilities into the adhesive composition.
Alkali phenols, especially paratertiary butyl phenol-based resoles, have excellent compatibility with certain synthetic elastomers, such as neoprene rubber. When used with neoprene, the phenolic is almost always chemically complex with a metal oxide (usually magnesium oxide). The phenolic/metal oxide complex provides tack and specific adhesion, elevated temperature strength, and solution viscosity stability to the neoprene.
Phenolics used for the various adhesive end uses described in this study represent only a small percentage of the total phenolic output. Other large markets contribute significantly to raw material availability and economics, and strongly impact phenolic products used in adhesives. Some of the other major markets for phenolics not included in this study include plywood and particleboard glues, fiber bonding used for insulation, foundry shell molding processes, bonded abrasives (such as grinding wheels), and molding materials. This resin classification market study report on phenolics estimates 2003 demand with a historical perspective back to 2000 as well as forecasts through 2005 and 2010 within the U.S. Adhesives Industry. |
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| Report Table of Contents |
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Phenolic / Phenolics Report - U.S. Adhesives Industry - RAW MATERIAL Market
Market Information - Forecasting Size and Growth Trends
Market Sector Information – Forecasting Size and Growth Trends
Market Segment Information – Forecasting Size and Growth Trends
Formulative Technology Information – Forecasting Size and Growth Trends
Raw Material Suppliers
Growth Opportunities – Size and Growth Trend
Commentary |
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